Company

Kandou

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Website
kandou.com

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  1. FPGA Engineer - 3 month contract, CH

    Saint-Sulpice, Switzerland · On-site · Contract

  2. Firmware Contractors, 6 months contract CH

    Saint-Sulpice, Switzerland · On-site · Contract

    May 14, 2026
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About Kandou

Revolutionary Copper MIMO technology eliminates costly HBM chips. 10X lower cost, 3X lower power, 8X more scale for next-gen AI systems and connectivity.