Back to jobs

Asmpthk

Open

R&D Manager

Location
Hong Kong, Hong Kong

About the role

We are seeking an experienced R&D Manager to lead the development of advanced semiconductor packaging solutions, with a focus on ultrasonic actuator technology, precision motion systems, and innovative mechatronic products. The successful candidate will manage engineering projects and teams, drive technology innovation, and collaborate closely with global R&D, manufacturing, and product teams to deliver high-performance products from concept to commercialization. Research & Development Lead the research, design, and development of advanced technologies to be applied in semiconductor packaging equipment. Develop, optimize, and design mechatronic precision system in Sub micron level Familiar with motion control is preferred. Conduct engineering simulations, performance analysis, and verification testing to achieve product performance and reliability objectives. Project Management Plan, manage, and monitor R&D projects to ensure timely delivery, budget control, and achievement of technical milestones. Coordinate resources and priorities across multiple development projects. Prepare project updates, technical reports, and development roadmaps for management review. Product Industrialization & Manufacturing Support Work closely with manufacturing teams to facilitate new product introduction (NPI) and technology transfer. Drive yield improvement, process optimization, cost reduction, and quality enhancement initiatives. Develop standardized production processes and engineering documentation to support mass production. Cross-Functional Collaboration Collaborate with global R&D teams, suppliers, and external partners on technology development projects. Provide technical expertise and problem-solving support for production, quality, operations, and customer-facing teams. Partner with product management to translate market requirements into technical solutions. Innovation & Intellectual Property Contribute to the development of proprietary technologies and intellectual property. Support patent filing activities and technology innovation initiatives. Monitor industry trends and emerging technologies within semiconductor packaging and precision engineering.